张天才,王永凤,张凯,杨骐,刘孝会,王艳艳.DSC 法研究聚醚胺 / 酚醛胺-环氧树脂体系的固化行为[J].包装工程,2013,34(7):7-9,33.
ZHANG Tian-cai,WANG Yong-feng,ZHANG Kai,YANG Qi,LIU Xiao-hui,WANG Yan-yan.Study on Curing Behavior of Polyether Amine/ Phenolic Amine-Epoxy Resin System with Differential Scanning Calorimertry[J].Packaging Engineering,2013,34(7):7-9,33. |
| DSC 法研究聚醚胺 / 酚醛胺-环氧树脂体系的固化行为 |
| Study on Curing Behavior of Polyether Amine/ Phenolic Amine-Epoxy Resin System with Differential Scanning Calorimertry |
| 投稿时间：2012-10-25 修订日期：2013-04-10 |
| DOI： |
| 中文关键词: 环氧树脂 聚醚胺 / 酚醛胺 固化行为 差示扫描量热法 |
| 英文关键词: epoxy resin polyether amine / phenolic amine curing behavior differential scanning calorimetry |
| 基金项目:国家自然科学基金委员会— — —中国工程物理研究院联合基金资助(U1230129) |
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| 中文摘要: |
| 采用示差扫描量热法(DSC),在 25 ~ 230 ℃范围内以不同的升温速率(5,10,15, 20 ℃ / min),研究了以聚醚胺 / 酚醛胺为固化剂的环氧树脂体系的固化行为,对其不同升温速率下的固化度进行了分析,采用 T-β 外推法得出了该体系的起始固化温度、峰顶固化温度和终止固化温度等固化工艺参数。 |
| 英文摘要: |
| Curing behavior of polyether amine / phenolic amine-epoxy resin system was studied using DSC at heating rates of 5, 10, 15 and 20 ℃ / min from 25 ℃ to 230 ℃ , and the curing states were analyzed in different heating rates. At last, initial curing temperature, maximum curing temperature, and terminal curing temperature were calculated by extrapolating T-β. |
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