张天才,王永凤,张凯,杨骐,刘孝会,王艳艳.DSC 法研究聚醚胺 / 酚醛胺-环氧树脂体系的固化行为[J].包装工程,2013,34(7):7-9,33.
ZHANG Tian-cai,WANG Yong-feng,ZHANG Kai,YANG Qi,LIU Xiao-hui,WANG Yan-yan.Study on Curing Behavior of Polyether Amine/ Phenolic Amine-Epoxy Resin System with Differential Scanning Calorimertry[J].Packaging Engineering,2013,34(7):7-9,33.
DSC 法研究聚醚胺 / 酚醛胺-环氧树脂体系的固化行为
Study on Curing Behavior of Polyether Amine/ Phenolic Amine-Epoxy Resin System with Differential Scanning Calorimertry
投稿时间:2012-10-25  修订日期:2013-04-10
DOI:
中文关键词:  环氧树脂  聚醚胺 / 酚醛胺  固化行为  差示扫描量热法
英文关键词:epoxy resin  polyether amine / phenolic amine  curing behavior  differential scanning calorimetry
基金项目:国家自然科学基金委员会— — —中国工程物理研究院联合基金资助(U1230129)
作者单位
张天才 西南技术工程研究所, 重庆 400039 
王永凤 西南技术工程研究所, 重庆 400039 
张凯 中国工程物理研究院, 绵阳 621000 
杨骐 西南技术工程研究所, 重庆 400039 
刘孝会 西南技术工程研究所, 重庆 400039 
王艳艳 西南技术工程研究所, 重庆 400039 
AuthorInstitution
ZHANG Tian-cai The Southwest Technology and Engineering Institute, Chongqing 400039, China 
WANG Yong-feng The Southwest Technology and Engineering Institute, Chongqing 400039, China 
ZHANG Kai China Academy of Engineering Physics, Mianyang 621000, China 
YANG Qi The Southwest Technology and Engineering Institute, Chongqing 400039, China 
LIU Xiao-hui The Southwest Technology and Engineering Institute, Chongqing 400039, China 
WANG Yan-yan The Southwest Technology and Engineering Institute, Chongqing 400039, China 
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中文摘要:
      采用示差扫描量热法(DSC),在 25 ~ 230 ℃范围内以不同的升温速率(5,10,15, 20 ℃ / min),研究了以聚醚胺 / 酚醛胺为固化剂的环氧树脂体系的固化行为,对其不同升温速率下的固化度进行了分析,采用 T-β 外推法得出了该体系的起始固化温度、峰顶固化温度和终止固化温度等固化工艺参数。
英文摘要:
      Curing behavior of polyether amine / phenolic amine-epoxy resin system was studied using DSC at heating rates of 5, 10, 15 and 20 ℃ / min from 25 ℃ to 230 ℃ , and the curing states were analyzed in different heating rates. At last, initial curing temperature, maximum curing temperature, and terminal curing temperature were calculated by extrapolating T-β.
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