文章摘要
王孟萍,石秀东,黄巧,王斌,许金州.基于感应加热的食品纸盒包装机封口温度场研究[J].包装工程,2017,38(7):130-134.
WANG Meng-ping,SHI Xiu-dong,HUANG Qiao,WANG Bin,XU Jin-zhou.Temperature Field of the Sealing of Food Carton Packaging Machine Based on Induction Heating[J].Packaging Engineering,2017,38(7):130-134.
基于感应加热的食品纸盒包装机封口温度场研究
Temperature Field of the Sealing of Food Carton Packaging Machine Based on Induction Heating
投稿时间:2016-10-18  修订日期:2017-04-10
DOI:
中文关键词: 感应加热  包装机  电磁场  温度场
英文关键词: induction heating  packaging machine  electromagnetic field  temperature field
基金项目:国家科技支撑计划(2015BAF12B00)
作者单位
王孟萍 江南大学无锡 214122 
石秀东 江南大学无锡 214122 
黄巧 江南大学无锡 214122 
王斌 江南大学无锡 214122 
许金州 江南大学无锡 214122 
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中文摘要:
      目的 研究仿真和试验验证实际工况下的温度分布满足封合要求。方法 利用Comsol软件对食品纸盒包装机热封机构进行建模,并对模型进行电磁场和温度场计算仿真与分析,模拟出电磁场中磁通分布与温度场中温度分布,分析得出其之间关系。以及进行食品纸盒包装机高频热封试验验证。结果 当在相同热封时间下,电流值越大,热封温度越高,同时热封封合宽度也越宽;在相同电流值下,热封时间越长,结果亦是,但没改变电流参数显著。实际工况为I=5.5 A,t=0.3 s,能达到良好封合要求。结论 封合温度在封合区域呈对称性,参数中改变电流值比改变热封时间值对热封温度影响大。
英文摘要:
      The work aims to study simulations and experiments to verify that the temperature distribution under the actual working conditions meets the requirements of sealing. Modeling of the heat sealing mechanism of food carton packaging machine was done with the Comsol software, and the electromagnetic field and temperature field of the model were calculated, simulated and analyzed, so as to simulate the magnetic flux distribution in the electromagnetic field and the temperature distribution in the temperature field, and to figure out their relationship through analysis. Moreover, the high-frequency heat sealing test for food carton packaging machine was verified. At the same heat sealing time, the greater the current value, the higher the heat sealing temperature and the wider the heat sealing width. At the same current value, the longer the heat sealing time, the higher the heat sealing temperature and the wider the heat sealing width; but the effect was not as significant as for the change in the current value. When the working conditions were: I=5.5 A, t=0.3 s, it could meet the requirements of good sealing. The sealing temperature is symmetrical in the sealing area. Compared to the change in the heat sealing time, the change in the current value among the parameters has a greater impact on the heat sealing temperature.
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