李祎,肖敦逸,吴岳忠,孙翱魁.基于知识图谱的智能包装研究现状与发展趋势分析[J].包装工程,2021,42(19):243-253.
LI Yi,XIAO Dun-yi,WU Yue-zhong,SUN Ao-kui.Status and Development Trend of Intelligent Packages Based on Knowledge Graph[J].Packaging Engineering,2021,42(19):243-253. |
| 基于知识图谱的智能包装研究现状与发展趋势分析 |
| Status and Development Trend of Intelligent Packages Based on Knowledge Graph |
| 投稿时间：2021-03-30 |
| DOI：10.19554/j.cnki.1001-3563.2021.19.031 |
| 中文关键词: 智能包装 知识图谱 CiteSpace 可视化分析 |
| 英文关键词:intelligent packaging knowledge graph CiteSpace visual analysis |
| 基金项目:国家重点研发计划子课题(2018YFB1700204);湖南省重点领域研发计划(2019GK2133);湖南省教育厅科学研究优秀青年项目(19B147);智能信息感知及处理技术湖南省重点实验室开放课题(2017KF07) |
| 作者 | 单位 |
| 李祎 | 湖南工业大学 包装与材料工程学院，湖南 株洲 412007 |
| 肖敦逸 | 湖南工业大学 包装与材料工程学院，湖南 株洲 412007 |
| 吴岳忠 | 湖南工业大学 包装与材料工程学院，湖南 株洲 412007;湖南省智能信息感知及处理技术重点实验室，湖南 株洲 412007 |
| 孙翱魁 | 湖南工业大学 包装与材料工程学院，湖南 株洲 412007 |
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| Author | Institution |
| LI Yi | School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China |
| XIAO Dun-yi | School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China |
| WU Yue-zhong | School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China;Hunan Key Laboratory for Intelligent Information Perception and Processing Technology, Zhuzhou 412007, China |
| SUN Ao-kui | School of Packaging and Materials Engineering, Hunan University of Technology, Zhuzhou 412007, China |
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| 中文摘要: |
| 目的 运用知识图谱可视化呈现智能包装目前研究现状，并探究其未来发展趋势，为行业相关从业者提供参考。方法 以CNKI数据库“智能包装”中文核心期刊文献为研究样本，利用CiteSpace知识图谱可视化分析软件，对研究样本数据从作者、机构、 |
| 英文摘要: |
| The work aims to present the research status of intelligent package in visualization by knowledge graph and explore the future development trend, thus providing a reference for relevant packaging professionals in the industry. With the Chinese core journal literature of ''intelligent package'' in CNKI database as the research sample, CiteSpace, a knowledge graph visualization analysis software, was used to make an overall analysis on the research sample data from the dimensions of authors, institutions, |
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